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Disclaimer

VAST SEMI discloses the information of product components in order to provide customers with products that comply with RoHS and REACH regulations as correctly as possible to meet customer needs and legal and regulatory requirements. However, the data is based on information provided by the raw material supplier, and some information may not be provided by the raw material supplier on the grounds of confidentiality, so absolute accuracy cannot be guaranteed. The product component information is an estimate of the average weight and component content of the product based on the above calculation formula. Moreover, it does not include impurities and metal raw materials diffused into the silicon device.


As product design and regulatory requirements are constantly updated, the content of this statement is for reference only, and VAST SEMI assumes no liability for inaccurate or incomplete information. If you have any questions about VAST SEMI product environment compliance with material management, please contact Customer Service window qacs.

Halogen-free product description

In view of the burning of electronic waste and plastic products containing halogen compounds, it is easy to produce toxic dioxins of the century, and there is bioaccumulation, causing health hazards. The electronics industry is extending halogen-free products to semiconductor devices based on IEC 61249-2-21:2003 “Printed Circuit Boards and other interconnected structural materials Part 2-21” standard requirements.


As part of its active involvement in environmental protection, VAST SEMI is committed to halogen-free semiconductor products and now has the capability to offer halogen-free products in all packages/series.


* Except for some customized products with special requirements of customers.

Lead-free product description

The pins of VAST SEMI's entire product range are lead-free plated.


Conflict mineral claim

Conflict Minerals CM refers to metal minerals (3TG) such as gold (Au), tantalum (Ta), tungsten (W), and tin (Sn)produced from mines in conflict areas controlled by non-government military groups or non-militaryfactions in theDemocratic Republic of the Congo. Profits from illegal mining by local military groups are stolen fromcitizens andcontribute to human rights violations and environmental degradation in eastern Democratic Republic ofthe Congo.


Such mineral products from areas that do not meet the “conflict-free norm”, with the exception of theDemocraticRepublic of the Congo (DRC), It also includes minerals from Rwanda, Uganda, Burundi, Tanzania, Kenya andother countriesdeemed by the United Nations Security Council to be derived from Congolese mines.


VAST SEMI strictly abides by the electronics industry Code of Conduct and fulfills its socialresponsibilityobligations. VAST SEMI requires all suppliers to source from accredited smelters and smelters that havebeen verified asconflict-free (through the Conflict-Free Smelter Program or other equivalent independent third-partyaudit program) toensure that the minerals used in the raw materials supplied to all customers are not from conflictzones.

Self-monitoring of annual reports

RoHS Statement

VAST SEMI’s entire product range meets the requirements of the EU RoHS Directive and provides customers with data on the compliance of our products with RoHS chemicals.

* Except for some customized products with special requirements of customers.

EU RoHS Directive Restricted Substance and Maximum PPM:

Eu RoHS Directive: The European Parliament and the Council of the European Union adopted the RoHS Directive in January 2003, which is a directive restricting the use of certain hazardous substances in electrical and electronic equipment.

Calculation of concentration of harmful substances of 10 substances controlled by RoHS directive:

  • The homogeneous material test value reflects the average concentration of hazardous substances controlled by the RoHS directive in the mean material
  • The measured value of the finished product reflects the average concentration of RoHS controlled hazardous substances in the product.
  • Calculation formula: Concentration (ppm) = mass of harmful substance (mg)/total weight of corresponding material (mg) *1000000
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Product component definition (Using SMD products as an example):

  • Molding Compound: Resin used to protect the original.
  • Lead Frame: As a base for fixing the chip and acting as an electrode
  • Die Attache: A material used to bond chips and frames
  • Chip (Die) : electrical main functional part
  • Wire Bond: The metal wire that connects the chip electrode to the frame electrode
  • Pin Plating Layer: Metal plating on the pin surface of the frame
  • Marking: The characters on the product body, including laser printing and ink printing.
Product exemption description:
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